Verdin AM62 Module

Quick Start

Get the binary-only SYSFW
Get binary-only TI Linux firmware
Build the ARM trusted firmware binary
Build the OPTEE binary
Build U-Boot for the R5
Build U-Boot for the A53
Flash to eMMC
Boot

For an overview of the TI AM62 SoC boot flow please head over to: AM62 Platforms

Sources:

Das U-Boot

source: https://source.denx.de/u-boot/u-boot.git

branch: master
Trusted Firmware-A (TF-A)

source: https://git.trustedfirmware.org/TF-A/trusted-firmware-a.git/

branch: master
Open Portable Trusted Execution Environment (OP-TEE)

source: https://github.com/OP-TEE/optee_os.git

branch: master
TI Firmware (TIFS, DM, SYSFW)

source: https://git.ti.com/git/processor-firmware/ti-linux-firmware.git

branch: ti-linux-firmware

Note

The TI Firmwares required for functionality of the system are (see platform specific boot diagram for further information as to which component runs on which processor):

TIFS - TI Foundational Security Firmware - Consists of purely firmware meant to run on the security enclave.
DM - Device Management firmware also called TI System Control Interface server (TISCI Server) - This component purely plays the role of managing device resources such as power, clock, interrupts, dma etc. This firmware runs on a dedicated or multi-use microcontroller outside the security enclave.

TIFS Stub - The TIFS stub is a small piece of binary designed to help restore the required security context and resume the TIFS firmware when the system resumes from low-power modes such as suspend-to-RAM/Deep Sleep. This stub uses the same encryption and customer key signing model as TIFS and is loaded into the ATCM (Tightly Coupled Memory ‘A’ of the DM R5) during DM startup. Due to the independent certificate signing process, the stub is maintained separately from DM.

Build procedure:

Setup the environment variables:

Generic environment variables
S/w Component	Env Variable	Description
All Software	CC32	Cross compiler for ARMv7 (ARM 32bit), typically arm-linux-gnueabihf-
All Software	CC64	Cross compiler for ARMv8 (ARM 64bit), typically aarch64-linux-gnu-
All Software	LNX_FW_PATH	Path to TI Linux firmware repository
All Software	TFA_PATH	Path to source of Trusted Firmware-A
All Software	OPTEE_PATH	Path to source of OP-TEE

Board specific environment variables
S/w Component	Env Variable	Description
U-Boot	UBOOT_CFG_CORTEXR	Defconfig for Cortex-R (Boot processor).
U-Boot	UBOOT_CFG_CORTEXA	Defconfig for Cortex-A (MPU processor).
Trusted Firmware-A	TFA_BOARD	Platform name used for building TF-A for Cortex-A Processor.
Trusted Firmware-A	TFA_EXTRA_ARGS	Any extra arguments used for building TF-A.
OP-TEE	OPTEE_PLATFORM	Platform name used for building OP-TEE for Cortex-A Processor.
OP-TEE	OPTEE_EXTRA_ARGS	Any extra arguments used for building OP-TEE.

Set the variables corresponding to this platform:

export CC32=arm-linux-gnueabihf-
export CC64=aarch64-linux-gnu-
export LNX_FW_PATH=path/to/ti-linux-firmware
export TFA_PATH=path/to/trusted-firmware-a
export OPTEE_PATH=path/to/optee_os

$ export UBOOT_CFG_CORTEXR=verdin-am62_r5_defconfig
$ export UBOOT_CFG_CORTEXA=verdin-am62_a53_defconfig
$ export TFA_BOARD=lite
$ # we don't use any extra TFA parameters
$ unset TFA_EXTRA_ARGS
$ export OPTEE_PLATFORM=k3-am62x
$ export OPTEE_EXTRA_ARGS="CFG_WITH_SOFTWARE_PRNG=y"

Trusted Firmware-A:

# inside trusted-firmware-a source
make CROSS_COMPILE=$CC64 ARCH=aarch64 PLAT=k3 SPD=opteed $TFA_EXTRA_ARGS \
     TARGET_BOARD=$TFA_BOARD

OP-TEE:

# inside optee_os source
make CROSS_COMPILE=$CC32 CROSS_COMPILE64=$CC64 CFG_ARM64_core=y $OPTEE_EXTRA_ARGS \
      PLATFORM=$OPTEE_PLATFORM

U-Boot:

3.1 R5:

# inside u-boot source
make $UBOOT_CFG_CORTEXR
make CROSS_COMPILE=$CC32 BINMAN_INDIRS=$LNX_FW_PATH

3.1.1 Alternative build of R5 for DFU boot:

As the SPL size can get too big when building with support for booting both from local storage and DFU an extra config fragment should be used to enable DFU support (and disable storage support)

export UBOOT_CFG_CORTEXR="${UBOOT_CFG_CORTEXR} am62x_r5_usbdfu.config"

# inside u-boot source
make $UBOOT_CFG_CORTEXR
make CROSS_COMPILE=$CC32 BINMAN_INDIRS=$LNX_FW_PATH

3.2 A53:

# inside u-boot source
make $UBOOT_CFG_CORTEXA
make CROSS_COMPILE=$CC64 BINMAN_INDIRS=$LNX_FW_PATH \
       BL31=$TFA_PATH/build/k3/$TFA_BOARD/release/bl31.bin \
       TEE=$OPTEE_PATH/out/arm-plat-k3/core/tee-raw.bin

Note

It is also possible to pick up a custom DM binary by adding TI_DM argument pointing to the file. If not provided, it defaults to picking up the DM binary from BINMAN_INDIRS. This is only applicable to devices that utilize split firmware.

3.2.1 Alternative build of A53 for Android bootflow:

Since the Android requires many more dependencies, it is disabled by default. An extra config fragment should be used to enable Android bootflow support.

export UBOOT_CFG_CORTEXR="${UBOOT_CFG_CORTEXA} am62x_a53_android.config"

# inside u-boot source
make $UBOOT_CFG_CORTEXA
make CROSS_COMPILE=$CC64 BINMAN_INDIRS=$LNX_FW_PATH \
       BL31=$TFA_PATH/build/k3/$TFA_BOARD/release/bl31.bin \
       TEE=$OPTEE_PATH/out/arm-plat-k3/core/tee-raw.bin

Note

It is also possible to pick up a custom DM binary by adding TI_DM argument pointing to the file. If not provided, it defaults to picking up the DM binary from BINMAN_INDIRS. This is only applicable to devices that utilize split firmware.

Flash to eMMC

=> mmc dev 0 1
=> fatload mmc 1 ${loadaddr} tiboot3.bin
=> mmc write ${loadaddr} 0x0 0x400
=> fatload mmc 1 ${loadaddr} tispl.bin
=> mmc write ${loadaddr} 0x400 0x1000
=> fatload mmc 1 ${loadaddr} u-boot.img
=> mmc write ${loadaddr} 0x1400 0x2000

As a convenience, instead of having to remember all those addresses and sizes, one may also use the update U-Boot wrappers:

> tftpboot ${loadaddr} tiboot3-am62x-gp-verdin.bin
> run update_tiboot3

> tftpboot ${loadaddr} tispl.bin
> run update_tispl

> tftpboot ${loadaddr} u-boot.img
> run update_uboot

Boot

Output:

U-Boot SPL 2023.10-rc1-00210-gb678170a34c (Aug 03 2023 - 00:09:14 +0200)
SYSFW ABI: 3.1 (firmware rev 0x0009 '9.0.1--v09.00.01 (Kool Koala)')
SPL initial stack usage: 13368 bytes
Trying to boot from MMC1
Authentication passed
Authentication passed
Authentication passed
Authentication passed
Authentication passed
Starting ATF on ARM64 core...

NOTICE:  BL31: v2.9(release):v2.9.0-73-g463655cc8
NOTICE:  BL31: Built : 14:51:42, Jun  5 2023
I/TC:
I/TC: OP-TEE version: 3.21.0-168-g322cf9e33 (gcc version 12.2.1 20221205 (Arm GNU Toolchain 12.2.Rel1 (Build arm-12.24))) #2 Mon Jun  5 13:04:15 UTC 2023 aarch64
I/TC: WARNING: This OP-TEE configuration might be insecure!
I/TC: WARNING: Please check https://optee.readthedocs.io/en/latest/architecture/porting_guidelines.html
I/TC: Primary CPU initializing
I/TC: SYSFW ABI: 3.1 (firmware rev 0x0009 '9.0.1--v09.00.01 (Kool Koala)')
I/TC: HUK Initialized
I/TC: Primary CPU switching to normal world boot

U-Boot SPL 2023.10-rc1-00210-gb678170a34c (Aug 03 2023 - 00:09:41 +0200)
SYSFW ABI: 3.1 (firmware rev 0x0009 '9.0.1--v09.00.01 (Kool Koala)')
SPL initial stack usage: 1840 bytes
Trying to boot from MMC1
Authentication passed
Authentication passed


U-Boot 2023.10-rc1-00210-gb678170a34c (Aug 03 2023 - 00:09:41 +0200)

SoC:   AM62X SR1.0 HS-FS
DRAM:  2 GiB
Core:  136 devices, 28 uclasses, devicetree: separate
MMC:   mmc@fa10000: 0, mmc@fa00000: 1
Loading Environment from MMC... OK
In:    serial@2800000
Out:   serial@2800000
Err:   serial@2800000
Model: Toradex 0076 Verdin AM62 Quad 2GB WB IT V1.0A
Serial#: 15037380
Carrier: Toradex Verdin Development Board V1.1A, Serial# 10754333
am65_cpsw_nuss ethernet@8000000: K3 CPSW: nuss_ver: 0x6BA01103 cpsw_ver: 0x6BA81103 ale_ver: 0x00290105 Ports:2 mdio_freq:1000000
Setting variant to wifi
Net:
Warning: ethernet@8000000port@1 MAC addresses don't match:
Address in ROM is             1c:63:49:22:5f:f9
Address in environment is     00:14:2d:e5:73:c4
eth0: ethernet@8000000port@1 [PRIME], eth1: ethernet@8000000port@2
Hit any key to stop autoboot:  0
Verdin AM62 #